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IM30A53 Quad-core ARM Embedded Board

KEY FEATURES

  • 3.5” Form Factor (146 mm x 102 mm) ARM Embedded Board
  • A53 Quad-core 2.0 GHz
  • 4GB LPDDR4, 32GB eMMC
  • Android 11
  • Integrated LVDS, eDP (Optional)
  • Rear IO Supports 1 x COM, 2 x USB 2.0, 1 x Micro USB, 1 x LAN ,1 x SD slot
  • CERTIFICATIONS
  • FCC CE

IM30

A53 Quad-core ARM Embedded Board
Overview
Specification
Winmate ARM Embedded Board IM30 with A53 Quad-core Processor

A53 Quad-core 2.0 GHz Processor

The IM30 industrial motherboard delivers next-generation ARM processing power and a highly versatile complement of industrial I/O. The Cortex A53 processor is the most extensively used low power CPU, and it may be utilized in a variety of devices that require excellent performance in low power situations. Equipped with Android 11, this industrial motherboard enables customers to easily develop a unique application of IoT.


Winmate ARM Embedded Board IM30 with Compact Form Factor

Fully Integrated Compact Industrial Motherboard

The board, which is only 102 x 146 mm in size, includes soldered LPDDR4 system memory, eMMC flash memory, and multiple I/O connectivity choices—providing both robust computing and a small footprint. Expansion is available via onboard SIM card slot.


Winmate ARM Embedded Board IM30 with LVDS Support

LVDS Support

The IM30 industrial motherboard support LVDS interface resolutions up to 1920x1080 pixels.


Winmate ARM Embedded Board IM30 with Low Power Consumption

Rugged Capabilities for IoT Applications

The IM30 industrial motherboard has been built for the rigors of modern industry to stand up to 24/7 operation and environmental challenges. The motherboards feature a wide operating temperature range of -20 to 60 degrees Celsius.

Winmate's industrial motherboard is ideal for a wide range of multimedia applications, including multiple signs displays at airports, train and bus stations, shopping malls, and other locations.

System Specification

Processor

ARM A53 Quad Core 2.0GHz

Memory

4GB LPDDR4

Storage

32GB eMMC

Operating System

Android 11

WLAN

Wi-Fi a/b/g/n/ac (Optional)

BT

Support (Optional)

WWAN

4G/LTE (Optional)

IO Ports

USB Port

2 x USB 2.0 Type A 1 x Micro USB 2.0 OTG

Serial Port

1 x RS232/422/485

LAN

1 x RJ45, Optional PoE(PD, 802.3AT)

Video

1 x Micro HDMI Output (Optional)

SD Card Slot

1 x Micro SD card slot (Max to 32GB)

SIM Card Slot

1 x Micro SIM Card Slot

Power Input

1 x 3-Pin Terminal Block, 12V DC

Internal IO Ports

Power output

1 x 5V output (2 Pin Wafer) 1x 3.3V output (2 Pin Waffer)

USB

4 x USB 2.0 (2x4 Waffer/per) 2 x USB 2.0 for Touch (FFC Connector)

UART

1 x 6 Pin for UART 1 x 6 Pin for Debug

Serial port

1 x RS232/422/485 (2x5 Waffer)

Display

1 x LVDS (DF13/FPC) 1 x EDP (15 Pin Waffer)

Backlight

1 x Backlight wafer(7 Pin)

WWAN Module Connector

1x M.2 Key-B USB

DIDO

1 x 14 Pin DIDO (6 DI, 6 DO, GND, 5V)

OSD

1 x GPIO for 5 key OSD (6 Pin Waffer) 1 x GPIO For Membrane OSD (2x5 Waffer)

Speaker

2 x Speaker (L/R, 2 Pin Waffer)

Backup battery

1 x RTC Battery

Microphone

2 x DMIC (4 Pin Waffer/Per) 1 x Analog MIC (2 Pin Waffer)

CANBus

1 x 4 Pin Waffer CANBus With Isolation (CANH, CANL, 5V)

I2C

1 x I2C

ANT

4 x ANT (Wi-Fi, BT, NFC)

Certification

Certification

CE, FCC

Mechanical

Dimension

146 x 102 mm

Environment

Operating Humidity

95% RH, (non-condensing)

Operating Temperature

-20°C to 60°C

Storage Temperature

-25°C to 65°C

Accessory

Accessory

Manual