MG30 ARM A78 + A55 Industrial Embedded Motherboard

KEY FEATURES

3.5” Form Factor (146 mm x 102 mm)
4GB LPDDR4, 32GB eMMC
Integrated LVDS, eDP (Optional)
ARM 2 x A78 2.0GHz + 4 x A55 2.0GHz
Rear I/O Supports 1 x COM, 2 x USB 2.0, 1 x USB Type-C, 1 x LAN ,1 x SD slot

CERTIFICATIONS

DATASHEET RESOURCE

MG30

ARM A78 + A55 Industrial Embedded Motherboard

Overview

Specification

Winmate MG30 Embedded Board with a compact 3.5-inch size, integrated with 4GB LPDDR4 and 32GB eMMC for industrial efficiency.

Compact 3.5” Form Factor with Integrated Storage

Designed with a 3.5” form factor (146 mm x 102 mm), the Winmate MG30 Motherboard is an ideal solution for embedded systems requiring compact and efficient hardware. Its small size ensures seamless integration into various industrial applications, including industrial automation, and IoT devices, without compromising performance.

Winmate MG30 Embedded Board powered by ARM Cortex-A78 and A55 cores, ensuring fast, efficient industrial performance.

Advanced ARM Architecture for High-Performance Computing

Powered by an ARM processor with 2 x A78 cores running at 2.0GHz and 4 x A55 cores at 2.0GHz, the Winmate MG30 Motherboard delivers a balanced combination of performance and power efficiency. This architecture is perfect for handling complex industrial tasks, including real-time data processing and multi-threaded applications.

Winmate MG30 Embedded Board with LVDS and optional eDP support for versatile industrial display integration.

Integrated Display Interfaces for Flexible Visual Output

Equipped with LVDS and optional eDP support, the Winmate MG30 Motherboard enables high-quality display integration. This flexibility makes it suitable for applications like digital signage, industrial control panels, and HMI systems, providing sharp visuals and responsive interaction.

Winmate MG30 Embedded Board offers USB, COM, LAN, and SD support, delivering robust connectivity for industrial applications.

Rich Connectivity for Enhanced Functionality

Winmate MG30 Motherboard features diverse rear I/O options, including 1 x COM port, 2 x USB 2.0, 1 x USB Type-C, 1 x LAN port, and 1 x SD slot. These connectivity options make it an ideal choice for applications requiring reliable data transfer, peripheral integration, and networking capabilities in industrial and embedded environments.

System Specification

Processor

ARM 2 x A78 2.0GHz + 4 x A55 2.0GHz

Memory

4GB LPDDR4

Storage

Onboard 32 GB

Operating System

Android 13 Linux Yocto 5.10.104 with QT 5.15 (Optional) Linux Ubuntu 22.04 (Optional)

IO Ports

USB Port

2 x USB 2.0 Type A 1 x USB 2.0 Type C (OTG)

Serial Port

1 x RS232/422/485

LAN

1 x RJ45 PoE(PD, 802.3AT) (Optional)

Video

1 x Micro HDMI (Optional)

SD Card Slot

1 x Micro SD card slot (Max to 32GB)

SIM Card Slot

1 x Micro SIM Card Slot

Expansion Port

1 x M.2 2230 E-key Slot (for Wi-Fi Module) 1 x M.2 3042 B-key Slot (for WWAN Module)

Power Input

1 x 3-Pin Terminal Block, 12V DC

Internal IO Ports

Power output

1 x 5V output (2 Pin Wafer) 1x 3.3V output (2 Pin Waffer)

USB

4 x USB 2.0 (2x4 Waffer/per) 2 x USB 2.0 for Touch (FFC Connector)

UART

1 x 6 Pin for UART 1 x 6 Pin for Debug

Serial port

1 x RS232/422/485 (2x5 Waffer)

Display

1 x LVDS (DF13) 1 x LVDS (FPC) (Optional) 1 x EDP (30 Pin Waffer) (Optional)

Backlight

1 x Backlight wafer(7 Pin)

DIDO

1 x 14 Pin DIDO (6 DI, 6 DO, GND, 5V)

OSD

1 x GPIO for 5 key OSD (6 Pin Waffer) 1 x GPIO For Membrane OSD (2x5 Waffer)

Speaker

2 x Speaker (L/R, 2 Pin Waffer)

Backup battery

1 x RTC Battery

Audio

1 x DMIC (4 Pin Waffer/Per) 1 x Analog MIC + Line out (5 Pin Waffer)

LED

2 x 4pin(1x4) for LED light bar indicator

I2C

2 x I2C

Certification

CE, FCC

Mechanical

Dimension

146 x 102 mm

Environment

Operating Humidity

95% RH, Non-Condensing

Operating Temperature

-20°C to 60°C

Storage Temperature

-25°C to 65°C

Accessory

Manual

Solutions & Success Stories

Corporate

Support

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