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FA30
NXP i.MX6 Dual Core Industrial ARM SBC

Winmate FA30 is a NXP i.MX6 Dual Core Industrial ARM SBC designed for OEM equipment design, embedded control, and industrial automation. This product helps industrial buyers, OEMs, and system integrators select a reliable Winmate solution for rugged, embedded, or mission-critical environments where performance, durability, and long lifecycle availability matter. Best for: The FA30 is best suited for OEM equipment design, embedded control, and industrial automation, especially when teams need stable hardware integration, dependable field operation, and a supplier with industrial computing experience. Key specifications: Important product highlights include 3.5" Form Factor (146mm x 101mm, industrial arm sbc, NXP i.MX6 Dual Core 1GHz, Upgradeable to Quad Core or 2GB RAM (Optional), Android 6.0 , Linux 4.1.15 QT 5.5 (Optional), Ubuntu 16.04 (Optional), 1 x micro SD/SDHC Card Slot, and Built-in 16GB eMMC. SEO search intent: This content is optimized for users searching for FA30, Winmate FA30, Winmate industrial embedded board, industrial embedded board, 3.5-inch industrial embedded board, and NXP i.MX6, and for purchase-intent queries related to industrial-grade Winmate hardware, rugged computing, embedded systems, and application-ready product solutions.

KEY FEATURES

  • 3.5" Form Factor (146mm x 101mm, industrial arm sbc
  • NXP i.MX6 Dual Core 1GHz
  • Upgradeable to Quad Core or 2GB RAM (Optional)
  • Android 6.0 , Linux 4.1.15 QT 5.5 (Optional), Ubuntu 16.04 (Optional)
  • 1 x micro SD/SDHC Card Slot
  • Built-in 16GB eMMC
  • Power Over Ethernet (PoE) Support (Optional)
  • 1 x Micro-HDMI Output

    CERTIFICATIONS

  • FCC
    CE

FA30

NXP i.MX6 Dual Core Industrial ARM SBC
Winmate ARM Embedded Board FA30 with Cortex A9

Cortex a9

The Cortex a9 development boards processor features a dual-issue, partially out-of-order pipeline and a flexible system architecture with configurable caches and system coherency using the ACP port. This embedded system with ARM-based boards comes with a working Linux installed and ready to use upon delivery. The arm-based board Cortex a9 processor achieves a better than 50% performance over the Cortex-A8 processor in a single-core configuration. This category also contains SD cards with Linux images that can be run on specific boards.

Most Recent CPU, Trustworthy layout, flexible I/O, very expanding, IoT-based architecture. Supply all styles fanless inserted PC & vehicle pc. Premium quality & Excellent cost. Total Ecosystem Partner. Artificial Intelligence Advantage Processing Focused. Leading IPC Producer. Broad Product Collection. Features: Complete Collection Of Varied Fanless Installed Pcs, Giving Large Variety Of Growth Alternatives.


Winmate ARM Embedded Board FA30 with Compact Form Factor

Fully integrated small-sized single-board computer

Space limitation is one of the constraints commonly seen in today's industrial environment. Winmate ARM series SBC series provides a palm-sized design to meet the space requirement and comes with adequate necessary I/O interfaces for gigabit ethernet various applications.

Designed to improve industrial computerization methods, including factory control and item lifecycle monitoring, all ingrained box Personal computers are dependable, flexible, and low-maintenance, and are the excellent choice for equipment sight architecture. PROCESSOR, DRAM, and mini cards are easily accessible and installable, and also each embedded package PC provides a large variety of development options.


Winmate ARM Embedded Board FA30 with Fanless Design

Fanless Design

Winmate IPC's Linux-based embedded single board computer (SBC) series with a wide range of powerful, high performance, compact, and flexible options in various form factors also offer different thermal solutions, from quiet, fanless design. Engineered for longevity and resilience, the BOX PCs are durable, highly scalable, and applicable for extreme environments such as factories and feature a user-friendly and highly flexible interface. Supplies a full line of assorted fanless embedded pcs of all dimensions to settle applications in transit, home entertainment, environmental and commercial center surveillance, biometrics, commercial manufacturing, food items production hands-free operation management, and surveillance control, building computerization, and also other appropriate IPC places.


Winmate ARM Embedded Board FA30 with LVDS Support

LVDS Support

Winmate ARM Series SBC support LVDS, interface up to 1366x768; LVDS is a physical layer specification only; many data communication standards and applications use it and add a data link layer as defined in the OSI model on top of it.

Low-voltage differential signaling, or even LVDS, also referred to as TIA/EIA -644, is a technical specification that specifies power characteristics of a differential, serial signaling specification. Yet, it is certainly not a method. LVDS functions at low power and can go for relatively high rates using economical twisted-pair copper cords. LVDS is a bodily coating standard; a lot of records communication requirements and applications use it and incorporate a data link coating as determined in the OSI version on best of it.

System Specification

Processor

NXP i.MX6 Dual Core, 1.0GHz

Memory

1GB (Default)
2GB (Optional)

Storage

eMMC: Onboard 16 GB (Default)
eMMC: Onboard 32 GB (Optional)

Operating System

Linux Ubuntu 18.04 (Optional)
Android 6.0 (Optional)
Debian 7.0 (Optional)
Linux 4.1.15 QT 5.5 (Optional)

WLAN

Support (Optional)

BT

Support (Optional)

IO Ports

USB Port

1 x Console Port (Mini USB)
1 x USB OTG (Micro USB)
1 x USB2.0 (Type-A)

Serial Port

1 x RS232/422/485 (Default RS232)

LAN

1 x LAN RJ45 Connector with PoE(PD, 802.3 at)

Video

1 x Micro HDMI (Optional)

SD Card Slot

1 x Micro SD card slot

CANBUS

1 x CANBUS, D-sub9

Power Input

1 x 12V DC, 2-Pin Terminal Block

DVD

GPIO

RJ-45

Internal IO Ports

Power output

1 x 2pin(1x2) blue wafer for 3.3V DC out
1 x 2pin(1x2) red wafer for 5V DC out
1 x 2pin(1x2) yellow wafer for 12V DC out

USB

5 x 4pin(1x4) for USB 2.0

UART

2 x 8pin(1x8) for UART
1 x 6pin(1x6) for debug

Display

1 x 40pin DF13 connector for LVDS

Backlight

1 x 7pin(1x7) for panel backlight
1 x 2pin(1x2) for backlight

DIDO

1 x 10pin(2x5) for Digital input/output

VR

1 x 3pin(1x3) for Backlight control VR

Speaker

2 x 2pin(1x2) for Speaker

Backup battery

1 x 2pin(1x2) for RTC battery

Audio

1 x 2pin(1x2) for Microphone

LED

Reset

1 x 4pin(1x4) for Reset

CAN2

1 x 4pin(1x4) for CAN2

I2C

1 x 12pin FPC connector for NFC
1 x 10pin FPC connector for Touch

Certification

Certification

CE, FCC

Mechanical

Dimension

146 x 102 mm

Environment

Operating Humidity

30% to 90% RH, Non-Condensing

Operating Temperature

-20°C to 60°C

Storage Temperature

-25°C to 65°C

Length

Power

Power Rating

12V DC

Adapter

12V 50W

POE

PoE (PD): follows IEEE 802.3at (25 W)

OPTIONAL ACCESSORIES

SATA Signal

SATA Signal

Model Name: MBK-SATA20

Part Number: 94H007Z070K0

  • Quantity: 1

Comport Cable

Comport Cable

Model Name: MBK-D9M180

Part Number: 94G309E100E1

  • Quantity :1 (For 3.5" Embedded Board)
  • Quantity :2 (For Mini-ITX Embedded Board)

USB Cable

USB Cable

Model Name: MBK-USBTA25

Part Number: 94E808E080K0

  • Quantity: 1

SATA Power

SATA Power

Model Name: MBK-SATA15P

Part Number: 94HE08Z150E0

  • Quantity: 1
Introduction to the NXP i.MX6 Dual Core SBC In today’s evolving embedded systems landscape, the NXP i.MX6 Dual Core Industrial ARM SBC stands out as a dependable and energy-efficient solution. Designed for performance-critical applications, this SBC (Single Board Computer) is based on the dual-core ARM Cortex-A9 processor, offering a balance of computing power, low power consumption, and robust I/O support — making it ideal for a wide range of industrial environments. Key Features of the i.MX6 Dual Core SBC This industrial ARM SBC delivers a comprehensive feature set tailored for deployment in rugged and mission-critical systems: Processor: Dual-core ARM Cortex-A9 up to 1.2GHz Graphics: Vivante GPU for advanced 2D/3D acceleration and Full HD playback Memory: Up to 2GB DDR3 RAM for smooth multitasking Storage: Onboard eMMC and microSD card support for flexible storage expansion Connectivity: Gigabit Ethernet, USB 2.0/3.0, UART, I²C, CAN bus, and SPI Display: Support for HDMI, LVDS, RGB interfaces Expansion: Mini PCIe slots for wireless modules and custom I/O Operating System: Supports Linux (Yocto, Ubuntu), Android, and real-time OS Industrial Grade: Wide temperature range support from -40°C to 85°C Optimized for Industrial Environments The NXP i.MX6 Dual Core SBC is engineered to meet the requirements of rugged industrial use. From factory automation to transportation systems, this SBC handles complex I/O tasks and real-time processing with minimal latency. Its fanless and compact design supports wall-mount, DIN-rail, or panel installation. Applications The versatility of the i.MX6 Dual Core SBC extends across various sectors: Industrial HMI Terminals IoT Edge Devices and Gateways Medical Monitoring Systems Kiosk and Digital Signage Fleet Management and Telematics Smart Building Controllers Data Acquisition Systems Why Choose NXP i.MX6 for Your Project? NXP’s long-term commitment to industrial silicon longevity ensures product lifecycle availability. The i.MX6 architecture is widely supported across open-source communities, simplifying development and integration into custom platforms. Its multi-display support, secure boot features, and advanced multimedia handling make it a go-to SBC for OEMs and industrial solution providers. Compatibility and Customization The board supports flexible boot options (eMMC, SD, USB), secure boot, and various interface combinations to match industry-specific needs. With BSP support for both Linux and Android, developers can easily prototype and scale products without worrying about hardware obsolescence. Conclusion If you're looking for an industrial ARM-based SBC that balances performance, cost-efficiency, and flexibility, the NXP i.MX6 Dual Core Industrial SBC is a top-tier choice. Its proven reliability and rich ecosystem make it ideal for long-term embedded deployments across global industries.