FA30
NXP i.MX6 Dual Core Industrial ARM SBC

Key Features

3.5" Form Factor (146mm x 101mm, industrial arm sbc
NXP i.MX6 Dual Core 1GHz
Upgradeable to Quad Core or 2GB RAM (Optional)
Android 6.0 , Linux 4.1.15 QT 5.5 (Optional), Ubuntu 16.04 (Optional)
1 x micro SD/SDHC Card Slot
Built-in 16GB eMMC
Power Over Ethernet (PoE) Support (Optional)
1 x Micro-HDMI Output

Introduction

Winmate ARM Embedded Board Series delivers high-performance, low-power solutions for diverse embedded applications. Featuring ARM-based processors such as Cortex-A53, Cortex-A9, and Qualcomm® Snapdragon™, these 3.5” form factor boards provide scalability and reliability. With configurations supporting up to 4GB LPDDR4 memory, multiple I/O interfaces, and optional features like PoE and eDP, they are ideal for industrial automation, IoT devices, medical equipment, and machine vision. Compatible with Linux, Android, and Ubuntu, the series ensures seamless integration for efficient and innovative system designs.

Specifications

System Specification

Processor

NXP i.MX6 Dual Core, 1.0GHz

Memory

1GB
2GB (Optional)

Storage

eMMC: Onboard 16 GB
eMMC: Onboard 32 GB (Optional)

Operating System

Linux Ubuntu 18.04 (Optional)
Android 6.0 (Optional)
Debian 7.0 (Optional)
Linux 4.1.15 QT 5.5 (Optional)

WLAN

Support (Optional)

IO Ports

Power Input

1 x 12V DC, 2-Pin Terminal Block

USB Port

1 x Console Port (Mini USB)
1 x USB OTG (Micro USB)
1 x USB2.0 (Type-A)

Serial Port

1 x RS232/422/485 (Default RS232)

SD Card Slot

1 x Micro SD card slot

Video

1 x Micro HDMI (Optional)

LAN

1 x LAN RJ45 Connector with PoE(PD, 802.3 at)

CANBUS

1 x CANBUS, D-sub9

Internal IO Ports

Power output

1 x 2pin(1x2) blue wafer for 3.3V DC out
1 x 2pin(1x2) red wafer for 5V DC out
1 x 2pin(1x2) yellow wafer for 12V DC out

USB

5 x 4pin(1x4) for USB 2.0

UART

2 x 8pin(1x8) for UART
1 x 6pin(1x6) for debug

Display

1 x 40pin DF13 connector for LVDS

Backlight

1 x 7pin(1x7) for panel backlight
1 x 2pin(1x2) for backlight

DIDO

1 x 10pin(2x5) for Digital input/output

1 x 3pin(1x3) for Backlight control VR

Speaker

2 x 2pin(1x2) for Speaker

Backup battery

1 x 2pin(1x2) for RTC battery

Audio

1 x 2pin(1x2) for Microphone

Reset

1 x 4pin(1x4) for Reset

CAN2

1 x 4pin(1x4) for CAN2

I2C

1 x 12pin FPC connector for NFC
1 x 10pin FPC connector for Touch

Certification

CE, FCC

Mechanical

Dimension

146 x 102 mm

Environment

Operating Humidity

30% to 90% RH, Non-Condensing

Operating Temperature

-20°C to 60°C

Storage Temperature

-25°C to 65°C

Power

Power Rating

12V DC

Adapter

12V 50W

POE

PoE (PD): follows IEEE 802.3at (25 W)

Dimensions Unit:mm

To preview the mechanical drawings, please contact the Winmate sales team for more information.

Note

1. This is a simplified drawing and some components are not marked in detail.
2. Please contact our sales representative if you need further product information.
3. All specifications are subject to change without prior notice.
4. The product shown in this datasheet is a standard model. For diagrams that contain customized or optional I/O, please contact the Winmate Sales Team for more information.

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FA30
NXP i.MX6 Dual Core Industrial ARM SBC

Key Features

Introduction

Specifications

Dimensions Unit:mm

Note

FA30NXP i.MX6 Dual Core Industrial ARM SBC

Key Features

Introduction

Specifications

Dimensions Unit:mm

Note

FA30
NXP i.MX6 Dual Core Industrial ARM SBC