IQ30
Qualcomm Single Board Computer

Key Features

3.5” Form Factor (146 mm x 102 mm)
Qualcomm® Snapdragon™ 660 octa-core, 2.2 GHz CPU
Integrated LVDS, eDP (Optional)
3GB LPDDR4 (Optional 4GB), 32GB eMMC
Rear IO Supports 1 x COM, 2 x USB 2.0, 1 x USB Type C, 1 x LAN ,1 x SD slot
Qualcomm single board computer

Introduction

Winmate ARM Embedded Board Series delivers high-performance, low-power solutions for diverse embedded applications. Featuring ARM-based processors such as Cortex-A53, Cortex-A9, and Qualcomm® Snapdragon™, these 3.5” form factor boards provide scalability and reliability. With configurations supporting up to 4GB LPDDR4 memory, multiple I/O interfaces, and optional features like PoE and eDP, they are ideal for industrial automation, IoT devices, medical equipment, and machine vision. Compatible with Linux, Android, and Ubuntu, the series ensures seamless integration for efficient and innovative system designs.

Overview

Winmate ARM Embedded Board IQ30 with Qualcomm Snapdragon™ 660 Processor

Snapdragon™ 660 Mobile Platform

The IQ30 SBC is powered by Qualcomm Snapdragon™ 660 processor that is suitable for Industrial IoT Applications. Taking advantage of Qualcomm’sPower Management IC (PMIC) innovative design, IQ30 features low power consumption offering performance, efficiency, and versatility for a variety of industrial and commercial applications.

Fanless Design

Winmate IPC's embedded single board computer (SBC) series with a wide range of powerful, compact, and flexible options in various form factors also offers various thermal solutions, from quiet, fanless design.

Winmate ARM Embedded Board IQ30 with Compact Form Factor

Fully integrated small-sized single-board computer

Space limitation is one of the constraints commonly seen in today’s industrial environment. Winmate Arm series SBC series not only provides a palm-sized design to meet the space requirement but also comes with adequate necessary I/O interfaces for various applications.

LVDS Support

Winmate Arm Series SBC support LVDS, interface up to 1366x768; LVDS is a physical layer specification only; many data communication standards and applications use it and add a data link layer as defined in the OSI model on top of it.

Winmate ARM Embedded Board IQ30 with Low Power Consumption

The Ultimate Choice for Industrial IoT Systems

Winmate IQ30 is an ultimate choice for new Industrial IoT application development. Robust features make it ideal for manufacturers to develop IoT edge devices in the factory automation and machine control, smart city, healthcare, kiosk applications.

Specifications

System Specification

Processor

Qualcomm® Snapdragon™ 660 (Octa-Core 2.2 GHz)

Memory

3GB LPDDR4

Storage

eMMC: Onboard 32 GB

Operating System

Android 9.0

WLAN

Support

WWAN

4G/LTE (Optional)

IO Ports

Power Input

1 x 3-Pin Terminal Block, 12V DC

USB Port

2 x USB 2.0 Type A 1 x USB Type C

Serial Port

1 x RS232/422/485

SD Card Slot

1 x Micro SD card slot (Max to 32GB)

SIM Card Slot

1 x Micro SIM Card Slot

Video

1 x Micro HDMI (Optional)

LAN

1 x RJ45, Optional PoE(PD, 802.3AT)

Internal IO Ports

Power output

1 x 5V output (2 Pin Waffer) 1x 3.3V output (2 Pin Waffer)

USB

3 x USB 2.0 (2x4 Waffer/per) 2 x USB 2.0 Touch (FFC Connector)

UART

2 x Light BAR / 1x4-pin with UART 1 x UART (TX, RX, 3.3V, GND)

Serial port

1 x RS232/422/485 (2x5 Waffer) 1 x RS232/422/485 (2x5 Waffer, 5V) (Optional)

Display

1 x LVDS (DF13/FPC) (Optional) 1 x EDP (15 Pin Waffer) (Optional)

Backlight

2 x Backlight waffer(5V/3.3V)

WWAN Module Connector

1 x M.2 (PCIe Signal With USB)

DIDO

1 x 14 Pin DIDO (6 DI, 6 DO, GND, 5V)

OSD

1 x GPIO for 5 key OSD (6 Pin Waffer) 1 x GPIO For Membrane OSD (2x5 Waffer)

Speaker

2 x Speaker (L/R, 2 Pin Waffer)

Backup battery

1 x RTC Battery

Microphone

2 x DMIC (4 Pin Waffer/Per) 1 x Analog MIC (2 Pin Waffer)

BIOS debug

1 x Debug Port (6 Pin Waffer)

CANBus

1 x 4 Pin Waffer CANBus With Isolation (CANH, CANL,5V) (Optional)

I2C

1 x I2C

ANT

3 x IPEX connector (Wi-Fi, BT, NFC)

Switch

1 x SW1 (SW Burnning Switch)

Certification

CE, FCC

Mechanical

Dimension

146 x 102 mm

Environment

Operating Humidity

95% RH, Non-Condensing

Operating Temperature

-20°C to 60°C

Storage Temperature

-25°C to 65°C

Accessory

Manual

Dimensions Unit:mm

Note

1. This is a simplified drawing and some components are not marked in detail.
2. Please contact our sales representative if you need further product information.
3. All specifications are subject to change without prior notice.
4. The product shown in this datasheet is a standard model. For diagrams that contain customized or optional I/O, please contact the Winmate Sales Team for more information.

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IQ30
Qualcomm Single Board Computer

Key Features

Introduction

Overview

Snapdragon™ 660 Mobile Platform

Fanless Design

Fully integrated small-sized single-board computer

LVDS Support

The Ultimate Choice for Industrial IoT Systems

Specifications

Dimensions Unit:mm

Note

IQ30 Qualcomm Single Board Computer

Key Features

Introduction

Overview

Snapdragon™ 660 Mobile Platform

Fanless Design

Fully integrated small-sized single-board computer

LVDS Support

The Ultimate Choice for Industrial IoT Systems

Specifications

Dimensions Unit:mm

Note

IQ30
Qualcomm Single Board Computer