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IQ30

Ordenador Monoplaca SBC Qualcomm

CARACTERÍSTICAS PRINCIPALES

  • 3.5” Form Factor (146 mm x 102 mm)
  • Qualcomm® Snapdragon™ 660 octa-core, 2.2 GHz CPU
  • Integrated LVDS, eDP (Optional)
  • 3GB LPDDR4 (Optional 4GB), 32GB eMMC
  • Rear IO Supports 1 x COM, 2 x USB 2.0, 1 x USB Type C, 1 x LAN ,1 x SD slot
  • Qualcomm single board computer

    CERTIFICATIONS

  • FCC
    CE

IQ30

Ordenador Monoplaca SBC Qualcomm
Resumen
Especificación
Accesorios
Placa base Winmate ARM IQ30 con procesador Qualcomm Snapdragon™ 660

Plataforma móvil Snapdragon™ 660

El SBC IQ30 está equipado con un procesador Qualcomm Snapdragon™ 660, adecuado para aplicaciones industriales de IoT. Aprovechando el diseño innovador del circuito integrado de gestión de energía (PMIC) de Qualcomm, el IQ30 presenta un bajo consumo de energía, lo que ofrece rendimiento, eficiencia y versatilidad para una variedad de aplicaciones industriales y comerciales.


Placa integrada Winmate ARM IQ30 con diseño sin ventilador

Diseño sin ventilador

La serie de computadoras de placa única integradas (SBC) de Winmate IPC, con una amplia gama de opciones potentes, compactas y flexibles en varios formatos, también ofrece varias soluciones térmicas, desde un diseño silencioso hasta uno sin ventilador.


Placa integrada Winmate ARM IQ30 con formato compacto

Ordenador monoplaca de tamaño pequeño totalmente integrado

La limitación de espacio es una de las restricciones que se observan comúnmente en el entorno industrial actual. La serie SBC de Winmate Arm no solo ofrece un diseño del tamaño de la palma de la mano para cumplir con los requisitos de espacio, sino que también viene con las interfaces de E/S necesarias para diversas aplicaciones.


Placa integrada Winmate ARM IQ30 con soporte LVDS

Compatibilidad con LVDS

Las SBC de la serie Arm de Winmate son compatibles con LVDS y tienen una interfaz de hasta 1366 x 768. LVDS es solo una especificación de capa física; muchos estándares y aplicaciones de comunicación de datos la utilizan y le agregan una capa de enlace de datos como se define en el modelo OSI.


Placa integrada Winmate ARM IQ30 con bajo consumo de energía

La mejor opción para sistemas de IoT industriales

Winmate IQ30 es la mejor opción para el desarrollo de nuevas aplicaciones de IoT industriales. Sus características robustas lo hacen ideal para que los fabricantes desarrollen dispositivos de IoT de borde en las aplicaciones de automatización de fábricas y control de máquinas, ciudades inteligentes, atención médica y quioscos.

System Specification

Processor

Qualcomm® Snapdragon™ 660 (Octa-Core 2.2 GHz)

Memory

3GB LPDDR4

Storage

eMMC: Onboard 32 GB

Operating System

Android 9.0

WLAN

Support

BT

Support

WWAN

4G/LTE (Optional)

IO Ports

USB Port

2 x USB 2.0 Type A
1 x USB Type C

Serial Port

1 x RS232/422/485

LAN

1 x RJ45, Optional PoE(PD, 802.3AT)

Video

1 x Micro HDMI (Optional)

SD Card Slot

1 x Micro SD card slot (Max to 32GB)

SIM Card Slot

1 x Micro SIM Card Slot

Power Input

1 x 3-Pin Terminal Block, 12V DC

Internal IO Ports

Power output

1 x 5V output (2 Pin Waffer)
1x 3.3V output (2 Pin Waffer)

USB

3 x USB 2.0 (2x4 Waffer/per)
2 x USB 2.0 Touch (FFC Connector)

UART

2 x Light BAR / 1x4-pin with UART
1 x UART (TX, RX, 3.3V, GND)

Serial port

1 x RS232/422/485 (2x5 Waffer) (Default)
1 x RS232/422/485 (2x5 Waffer, 5V) (Optional)

Display

1 x LVDS (DF13/FPC) (Optional)
1 x EDP (15 Pin Waffer) (Optional)

Backlight

2 x Backlight waffer(5V/3.3V)

WWAN Module Connector

1 x M.2 (PCIe Signal With USB)

DIDO

1 x 14 Pin DIDO (6 DI, 6 DO, GND, 5V)

OSD

1 x GPIO for 5 key OSD (6 Pin Waffer)
1 x GPIO For Membrane OSD (2x5 Waffer)

Speaker

2 x Speaker (L/R, 2 Pin Waffer)

Backup battery

1 x RTC Battery

Microphone

2 x DMIC (4 Pin Waffer/Per)
1 x Analog MIC (2 Pin Waffer)

BIOS debug

1 x Debug Port (6 Pin Waffer)

CANBus

1 x 4 Pin Waffer CANBus With Isolation (CANH, CANL,5V) (Optional)

I2C

1 x I2C

ANT

3 x IPEX connector (Wi-Fi, BT, NFC)

Switch

1 x SW1 (SW Burnning Switch)

Certification

Certification

CE, FCC

Mechanical

Dimension

146 x 102 mm

Environment

Operating Humidity

95% RH, Non-Condensing

Operating Temperature

-20°C to 60°C

Storage Temperature

-25°C to 65°C

Accessory

Accessory

Manual

OPTIONAL ACCESSORIES

SATA Signal

SATA Signal

Model Name: MBK-SATA20

Part Number: 94H007Z070K0

  • Quantity: 1

Comport Cable

Comport Cable

Model Name: MBK-D9M180

Part Number: 94G309E100E1

  • Quantity :1 (For 3.5" Embedded Board)
  • Quantity :2 (For Mini-ITX Embedded Board)

USB Cable

USB Cable

Model Name: MBK-USBTA25

Part Number: 94E808E080K0

  • Quantity: 1

SATA Power

SATA Power

Model Name: MBK-SATA15P

Part Number: 94HE08Z150E0

  • Quantity: 1
Winmate embedded computing box pc is a compact industrial box pc and designed for a wide variety of industrial automation or machine-to-machine applications. It combines an Intel or ARM latest processor with extensive and flexible I/O support both for legacy connections requiring serial ports, as well as standard USB connections and gigabit Ethernet. Good thermal engineering means no fan and therefore no ventilation holes. These devices are perfectly fit for simple automation control and communication tasks and for data collection in industrial and building automation control, factory automation, and data transmission applications. Overall, with the compact, fanless Intel based Embedded Box PC, Winmate offers a high computing performance Box PC with plenty of I/O that does not need much space and fits almost everywhere Winmate qualcomm single board computer powered by the Qualcomm® Snapdragon™ 660 application processor. The plug-and-play Micro SBC reference design provides industrial IoE system designers instant access to the compute power, comprehensive I/O, and connectivity of the Snapdragon 660SoC. Powered by quad-core ARM® CPUs, the Winmate Micro SBC is the 3rd in the family of Snapdragon processor-based embedded computing platforms from Inforce. Unique features include support for WiFi/BLE, GPS, HDMI displays, GbE ports, LVDS, and optional PoE and RS485 interfaces. With robust support for an upstream Linux kernel (Linaro) and Android (Lollipop), coupled with extended operating temperature and long lifecycle, the Winmate qualcomm single board Micro SBC provides an ideal choice for a multitude of industrial applications. The qualcomm single board computeris the industry’s first truly scalable multicore platform that includes single-, dual- and quad- core families based on the ARM architecture. With high-performance multimedia processing and integrated power management, the i.MX 6 series is fit for the new era of smart devices. ## pico apl motherboard rtc jetson atx fsb motherboards nvidia jetson nano jetson nano acd tiger lake h upn emb tablet computers hsb i7 processor ip68 atx motherboard intel 11th gen lga 1151 mini itx nvidia jetson tks whu i5-6300u micro atx motherboar pfm agd motherbord nvidias ai jetsons 1125 2122 acan etx gpu t4 itx jetson tx2 nx module lga1151 micro atx motherboard mini-itx tablet 7 tablets computers 英伟达 5600 bd1 boxer machine epiccom go upx itx motherboard single board computer upx visionplus .acd 15 x5 g50 gene's page ice lake jetson nvidia mini atx nano itx pc box squared up x5-z8350 2250 847e cpu core board design for manufacturing edge pro i5 6300u i7 11th gen industrial cyber security jetson nano 4gb mother boards pcs electronic pico. q67 q77 tiger lake touch monitor what is 0 squared 7 tablet ai solutions atx vs micro atx b ln core nano cv1 fws meaning intel processor generations jetson xavier nx ln0.5 m-atx miniitx nvidia ai pd edge pi co riser card type 10 1 pico 32m intel